ALEXANDRIA, Va., June 19 -- United States Patent no. 12,334,339, issued on June 17, was assigned to DENSO Corp. (Kariya, Japan), TOYOTA JIDOSHA K.K. (Toyota, Japan), MIRISE Technologies Corp. (Nisshin, Japan), National University Corporation Tokai National Higher Education and Research System (Nagoya, Japan) and HAMAMATSU PHOTONICS K.K. (Hamamatsu, Japan).
"Manufacturing method of semiconductor device" was invented by Shosuke Nakabayashi (Nisshin, Japan), Masatake Nagaya (Nisshin, Japan), Chiaki Sasaoka (Nagoya, Japan), Shoichi Onda (Nagoya, Japan), Jun Kojima (Nagoya, Japan), Daisuke Kawaguchi (Hamamatsu, Japan), Ryuji Sugiura (Hamamatsu, Japan), Toshiki Yui (Hamamatsu, Japan), Keisuke Hara (Hamamatsu, Japan) and Tomomi Aratani (Hamamatsu...