US Patent Issued to DENSO, TOYOTA JIDOSHA, MIRISE Technologies, HAMAMATSU PHOTONICS, National University Corporation Tokai National Higher Education and Research System on Nov. 18 for "Semiconductor chip and method for manufacturing the same" (Japanese Inventors)

ALEXANDRIA, Va., Nov. 18 -- United States Patent no. 12,476,156, issued on Nov. 18, was assigned to DENSO Corp. (Kariya, Japan), TOYOTA JIDOSHA K.K. (Toyota, Japan), MIRISE Technologies Corp. (Nisshin, Japan), HAMAMATSU PHOTONICS K.K. (Hamamatsu, Japan) and National University Corporation Tokai National Higher Education and Research System (Nagoya, Japan).

"Semiconductor chip and method for manufacturing the same" was invented by Masatake Nagaya (Nisshin, Japan), Hiroki Watanabe (Nisshin, Japan), Junji Ohara (Nisshin, Japan), Daisuke Kawaguchi (Hamamatsu, Japan), Keisuke Hara (Hamamatsu, Japan), Chiaki Sasaoka (Nagoya, Japan), Jun Kojima (Nagoya, Japan) and Shoichi Onda (Nagoya, Japan).

According to the abstract* released by the U.S. Pate...