US Patent Issued to DENSO, TOYOTA JIDOSHA, MIRISE Technologies, HAMAMATSU PHOTONICS, National University Corporation Tokai National Higher Education and Research System on Nov. 11 for "Method for manufacturing semiconductor device, and semiconductor wafer" (Japanese Inventors)

ALEXANDRIA, Va., Nov. 11 -- United States Patent no. 12,467,161, issued on Nov. 11, was assigned to DENSO Corp. (Kariya, Japan), TOYOTA JIDOSHA K.K. (Toyota, Japan), MIRISE Technologies Corp. (Nisshin, Japan), HAMAMATSU PHOTONICS K.K. (Hamamatsu, Japan) and National University Corporation Tokai National Higher Education and Research System (Nagoya, Japan).

"Method for manufacturing semiconductor device, and semiconductor wafer" was invented by Junji Ohara (Nisshin, Japan), Takashi Ishida (Nisshin, Japan), Yoshitaka Nagasato (Nisshin, Japan), Daisuke Kawaguchi (Hamamatsu, Japan), Chiaki Sasaoka (Nagoya-shi, Japan), Shoichi Onda (Nagoya, Japan) and Jun Kojima (Nagoya, Japan).

According to the abstract* released by the U.S. Patent & Trademar...