US Patent Issued to Dell Products on July 1 for "Fan covering with high recycle content and high thermal conductivity" (Singaporean, American Inventors)

ALEXANDRIA, Va., July 3 -- United States Patent no. 12,345,273, issued on July 1, was assigned to Dell Products LP (Round Rock, Texas).

"Fan covering with high recycle content and high thermal conductivity" was invented by Deeder M. Aurongzeb (Austin, Texas), Mark Andrew Schwager (Cedar Park, Texas) and Peng Lip Goh (Singapore).

According to the abstract* released by the U.S. Patent & Trademark Office: "Disclosed is a covering of a fan unit of an information handling system. The covering contains a bottom covering and a top covering. The bottom covering contains i) copper and an first aluminum alloy, or ii) 10 wt. % to 50 wt. % of a thermally conductive plastic, and 50 wt. % to 90 wt. % of a post-consumer-recycled (PCR) plastic and/or bio...