US Patent Issued to DAICEL on Nov. 4 for "Photoresist resin, method for producing photoresist resin, photoresist resin composition, and method for forming pattern" (Japanese Inventors)

ALEXANDRIA, Va., Nov. 6 -- United States Patent no. 12,461,443, issued on Nov. 4, was assigned to DAICEL Corp. (Osaka, Japan).

"Photoresist resin, method for producing photoresist resin, photoresist resin composition, and method for forming pattern" was invented by Akinori Ito (Tokyo) and Akira Eguchi (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "Provided is a resin that exhibits high resist performance because a poorly soluble component with respect to a resist solvent is reduced, and a production method for the resin. Disclosed is a photoresist resin containing an acrylic resin, in which when the photoresist resin is dissolved in propylene glycol monomethyl ether acetate in such a way that a resin ...