US Patent Issued to City University of Hong Kong on Oct. 21 for "Method for recovering metal from waste printed circuit board and a cell thereof" (Chinese Inventor)

ALEXANDRIA, Va., Oct. 28 -- United States Patent no. 12,448,695, issued on Oct. 21, was assigned to City University of Hong Kong (Kowloon, Hong Kong).

"Method for recovering metal from waste printed circuit board and a cell thereof" was invented by Chun Ho Lam (Fo Tan, Hong Kong).

According to the abstract* released by the U.S. Patent & Trademark Office: "A metal recovery device for recovering metal in a waste printed circuit board by way of electrodeposition including: a cathode, an anode, and an electrolyte in electrical communication with the cathode and the anode, wherein the electrolyte includes a glycol-based compound and a metal chloride. A method of preparing an electrolyte for use in the same. A method of metal recovery for recov...