US Patent Issued to Canon on July 15 for "Molded resin product, method for manufacturing molded resin product, mold, and apparatus for manufacturing molded resin product" (Japanese Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,358,195, issued on July 15, was assigned to Canon K.K. (Tokyo).

"Molded resin product, method for manufacturing molded resin product, mold, and apparatus for manufacturing molded resin product" was invented by Toshimitsu Nagoya (Kanagawa, Japan), Kei Oikawa (Kanagawa, Japan), Makoto Kojima (Kanagawa, Japan), Takahiro Suzuki (Tokyo) and Mao Mukaida (Saitama, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A molded resin product includes a plurality of protrusions formed in a predetermined region. A histogram indicating a height distribution of the plurality of protrusions has two peaks having a boundary height as a boundary therebetween. In a case w...