US Patent Issued to Brunswick on June 17 for "Fastening structures with high coefficient of thermal expansion for reduction of thermally driven stresses in securing aluminum silicon alloys" (Wisconsin Inventors)

ALEXANDRIA, Va., June 19 -- United States Patent no. 12,331,698, issued on June 17, was assigned to Brunswick Corp. (Mettawa, Ill.).

"Fastening structures with high coefficient of thermal expansion for reduction of thermally driven stresses in securing aluminum silicon alloys" was invented by Daniel P. Hoffman (Fond du Lac, Wis.), Kevin R. Anderson (Fond du Lac, Wis.), Christopher J. Misorski (Fond du Lac, Wis.) and Jeremy J. Dion (Port Washington, Wis.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A fastening structure for securing two disparate sections of an aluminum silicon alloy product. A precipitation hardenable austenitic stainless steel bolt engages each hole of a first and second aluminum silicon ...