US Patent Issued to Avago Technologies International Sales on Nov. 4 for "Integrated antennas on side wall of 3D stacked die" (California, Colorado Inventors)

ALEXANDRIA, Va., Nov. 6 -- United States Patent no. 12,463,319, issued on Nov. 4, was assigned to Avago Technologies International Sales Pte. Ltd. (Singapore).

"Integrated antennas on side wall of 3D stacked die" was invented by Sam Karikalan (Ladera Ranch, Calif.), Sam Zhao (Irvine, Calif.), Mayank Mayukh (Fort Collins, Colo.), Dharmendra Saraswat (Foothill Ranch, Calif.), Liming Tsau (Irvine, Calif.), Arun Ramakrishnan (Lake Forest, Calif.) and Reza Sharifi (Irvine, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package with integrated side wall antennas is provided. An apparatus includes two or more die layers that are bonded together, each of the two or more die layers comprising a...