US Patent Issued to Arizona Board of Regents on Behalf of the University of Arizona on April 22 for "Assembly of flexible optical waveguides and photonic chips for optical interconnection packaging" (Arizona Inventors)

ALEXANDRIA, Va., June 6 -- United States Patent no. 12,280,556, issued on April 22, was assigned to Arizona Board of Regents on Behalf of the University of Arizona (Tucson, Ariz.).

"Assembly of flexible optical waveguides and photonic chips for optical interconnection packaging" was invented by Linan Jiang (Tucson, Ariz.), Stanley K. H. Pau (Tucson, Ariz.), Robert A. Norwood (Tucson, Ariz.) and Thomas L. Koch (Tucson, Ariz.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method of forming an optical interconnect between first and second photonic chips located on an optical printed circuit board (OPCB) includes applying a coupling agent to a bonding surface of a flexible, freestanding polymer waveguide array...