US Patent Issued to Applied Materials on July 15 for "Film stress control for plasma enhanced chemical vapor deposition" (South Korean, American Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,362,149, issued on July 15, was assigned to Applied Materials Inc. (Santa Clara, Calif.).

"Film stress control for plasma enhanced chemical vapor deposition" was invented by Chien-Teh Kao (Sunnyvale, Calif.), Tae Kyung Won (San Jose, Calif.), Carl A. Sorensen (Morgan Hill, Calif.), Sanjay D. Yadav (Morgan Hill, Calif.), Young Dong Lee (Hwaseong-Si, South Korea), Shinichi Kurita (San Jose, Calif.) and Soo Young Choi (Fremont, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Embodiments of the present disclosure include methods and apparatus for depositing a plurality of layers on a large area substrate. In one embodiment, a processing chamber for pl...