US Patent Issued to Applied Materials on Jan. 20 for "Gas entrainment during jetting of fluid for temperature control in chemical mechanical polishing" (California Inventors)

ALEXANDRIA, Va., Jan. 20 -- United States Patent no. 12,528,151, issued on Jan. 20, was assigned to Applied Materials Inc. (Santa Clara, Calif.).

"Gas entrainment during jetting of fluid for temperature control in chemical mechanical polishing" was invented by Surajit Kumar (San Jose, Calif.), Hui Chen (San Jose, Calif.), Chih Chung Chou (San Jose, Calif.) and Shou-Sung Chang (Mountain View, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A chemical mechanical polishing system includes a platen to support a polishing pad having a polishing surface, and a pad cooling assembly. The pad cooling assembly has an arm extending over the platen, a nozzle suspended by the arm and coupled to a source of coolant ...