ALEXANDRIA, Va., Dec. 31 -- United States Patent no. 12,512,431, issued on Dec. 30, was assigned to Air Products and Chemicals Inc. (Allentown, Pa.).

"Apparatus and method for wafer oxide removal and reflow treatment" was invented by Liang Wu (Shanghai), Wenshan Pang (Shanghai), Lulu Qi (Shanghai), Xiang Yu (Shanghai), Leijian Yu (Shanghai), Jiong Chen (Shanghai), Gregory Khosrov Arslanian (Pipersville, Pa.) and Yuxiang Zhou (Shanghai).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present invention relates to an apparatus and method for wafer oxide removal and reflow treatment. In particular, the present invention relates to an apparatus for wafer oxide removal and reflow treatment, comprising: a heating...