US Patent Issued to Agency for Science, Technology and Research on Sept. 9 for "Transducer, device and method for monitoring integrity of an adhesive bond" (Singaporean Inventors)

ALEXANDRIA, Va., Sept. 10 -- United States Patent no. 12,411,112, issued on Sept. 9, was assigned to Agency for Science, Technology and Research (Singapore).

"Transducer, device and method for monitoring integrity of an adhesive bond" was invented by Zheng Zheng Wong (Singapore), Kui Yao (Singapore), Shuting Chen (Singapore) and Lei Zhang (Singapore).

According to the abstract* released by the U.S. Patent & Trademark Office: "A transducer for monitoring integrity of an adhesive bond between a first element and a second element, the transducer comprising: a transducing adhesive, the transducing adhesive provided to act as at least one of: an actuator to convert an electrical signal to an acoustic signal and a sensor to convert an acoustic ...