INTERNATIONAL PATENT: ZTE CORPORATION, 中兴通讯股份有限公司 FILES APPLICATION FOR "VIA STRUCTURE OF CIRCUIT BOARD, CIRCUIT BOARD AND ELECTRONIC DEVICE"

GENEVA, Nov. 17 -- ZTE CORPORATION (ZTE Plaza, Keji Road SouthHi-Tech Industrial Park, Nanshan District,Shenzhen, Guangdong 518057), 中兴通讯股份有限公司 (中国广东省深圳市南山区高新技术产业园科技南路中兴通讯大厦) filed a patent application (PCT/CN2025/086580) for "VIA STRUCTURE OF CIRCUIT BOARD, CIRCUIT BOARD AND ELECTRONIC DEVICE" on Apr 01, 2025. With publication no. WO/2025/232394, the details related to the patent application was published on Nov 13, 2025.

Notably, the patent application was submitted under the ...