INTERNATIONAL PATENT: ZTE CORPORATION, 中兴通讯股份有限公司 FILES APPLICATION FOR "CONDUCTIVE BRIDGING MEMORY AND MANUFACTURING METHOD THEREFOR"

GENEVA, May 17 -- ZTE CORPORATION (ZTE Plaza, Keji Road SouthHi-Tech Industrial Park, Nanshan DistrictShenzhen, Guangdong 518057), 中兴通讯股份有限公司 (中国广东省深圳市南山区高新技术产业园科技南路中兴通讯大厦) filed a patent application (PCT/CN2024/122454) for "CONDUCTIVE BRIDGING MEMORY AND MANUFACTURING METHOD THEREFOR" on Sep 29, 2024. With publication no. WO/2025/098062, the details related to the patent application was published on May 15, 2025.

Notably, the patent application was submitted under the Internati...