GENEVA, June 30 -- ZHUZHOU CRRC TIMES SEMICONDUCTOR CO., LTD. (Semiconductor Line 3, Tianxin High-tech Zone, Shifeng DistrictZhuzhou, Hunan 412005), 株洲中车时代半导体有限公司 (中国湖南省株洲市石峰区田心高科园半导体三线) filed a patent application (PCT/CN2024/128867) for "ELECTRONIC PACKAGING DEVICE AND POWER MODULE" on Oct 31, 2024. With publication no. WO/2025/130373, the details related to the patent application was published on Jun 26, 2025.
Notably, the patent application was submitted under the International Patent Classification (IP...