INTERNATIONAL PATENT: ZHENGZHOU CHAOKUO ELECTRONIC TECHNOLOGY CO., LTD., 郑州潮阔电子科技有限公司 FILES APPLICATION FOR "MELTING ASSEMBLY, MELTING ASSEMBLY AND HEATING STRUCTURE FOR MELTING 3D PRINTING CONSUMABLE AND 3D PRINTER"

Posted On: 2025-06-09

GENEVA, June 9 -- ZHENGZHOU CHAOKUO ELECTRONIC TECHNOLOGY CO., LTD. (Room 502 and 503, Building 6, Phase II, No. 27 Fenglin Road, High-tech Industrial Development ZoneZhengzhou, Henan 450000), 郑州潮阔电子科技有限公司 (中国河南省郑州市高新区高新技术产业开发区枫林路27号二期6＃楼502、503室) filed a patent application (PCT/CN2024/135339) for "MELTING ASSEMBLY, MELTING ASSEMBLY AND HEATING STRUCTURE FOR MELTING 3D PRINTING CONSUMABLE, AND 3D PRINTER" on Nov 28, 2024. With publication no. WO/2025/1...

Click here to read full article from source

To read the full article or to get the complete feed from this publication, please Contact Us.

Exclusive

Category

Source

Publication

Location

INTERNATIONAL PATENT: ZHENGZHOU CHAOKUO ELECTRONIC TECHNOLOGY CO., LTD., 郑州潮阔电子科技有限公司 FILES APPLICATION FOR "MELTING ASSEMBLY, MELTING ASSEMBLY AND HEATING STRUCTURE FOR MELTING 3D PRINTING CONSUMABLE AND 3D PRINTER"