GENEVA, March 17 -- YUPO CORPORATION (4-3 Kanda-Surugadai, Chiyoda-ku, Tokyo1010062), 株式会社ユポ・コーポレーション (東京都千代田区神田駿河台４丁目３番地) filed a patent application (PCT/JP2024/005474) for "LABELED MOLDED OBJECT" on Feb 16, 2024. With publication no. WO/2025/052688, the details related to the patent application was published on Mar 13, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Inventor(...