INTERNATIONAL PATENT: YKK CORPORATION, ＹＫＫ株式会社 FILES APPLICATION FOR "THICKNESS MEASUREMENT APPARATUS AND THICKNESS MEASUREMENT METHOD"

GENEVA, Feb. 24 -- YKK CORPORATION (1, Kanda Izumi-cho, Chiyoda-ku, Tokyo1018642), ＹＫＫ株式会社 (東京都千代田区神田和泉町１番地) filed a patent application (PCT/JP2023/029496) for "THICKNESS MEASUREMENT APPARATUS AND THICKNESS MEASUREMENT METHOD" on Aug 15, 2023. With publication no. WO/2025/037375, the details related to the patent application was published on Feb 20, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): KUROHARA, Takehiro (c/o YKK Corporation Kuro...