INTERNATIONAL PATENT: XPEEDIC CO., LTD., 芯和半导体科技（上海）股份有限公司 FILES APPLICATION FOR "METHOD FOR PICKING UP FEATURE POINTS OF EDA MODEL AND SYSTEM AND MEDIUM"

GENEVA, May 16 -- XPEEDIC CO., LTD. (Room 01, 4th Floor, No. 5, Lane 60Naxian Road, Pudong New AreaShanghai 201210), 芯和半导体科技（上海）股份有限公司 (中国上海市浦东新区纳贤路60弄5号4层01室) filed a patent application (PCT/CN2023/141141) for "METHOD FOR PICKING UP FEATURE POINTS OF EDA MODEL, AND SYSTEM AND MEDIUM" on Dec 22, 2023. With publication no. WO/2025/097567, the details related to the patent application was published on May 15, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) sys...