INTERNATIONAL PATENT: XPEEDIC CO., LTD., 芯和半导体科技（上海）股份有限公司 FILES APPLICATION FOR "EDA MODEL SIMULATION METHOD"

GENEVA, May 25 -- XPEEDIC CO., LTD. (Room 01, 4th Floor, No.5, Lane 60, Naxian RoadPudong New Area, Shanghai 201210), 芯和半导体科技（上海）股份有限公司 (中国上海市浦东新区纳贤路60弄5号4层01室) filed a patent application (PCT/CN2023/141131) for "EDA MODEL SIMULATION METHOD" on Dec 22, 2023. With publication no. WO/2025/102488, the details related to the patent application was published on May 22, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellect...