INTERNATIONAL PATENT: XPEEDIC CO., LTD., 芯和半导体科技（上海）股份有限公司 FILES APPLICATION FOR "DXF DATA IMPORT MODELING METHOD, SYSTEM AND MEDIUM"

GENEVA, May 4 -- XPEEDIC CO., LTD. (Room 01, 4th Floor, No.5, Lane 60, Naxian RoadPudong New Area, Shanghai 201210), 芯和半导体科技（上海）股份有限公司 (中国上海市浦东新区纳贤路60弄5号4层01室) filed a patent application (PCT/CN2023/140176) for "DXF DATA IMPORT MODELING METHOD, SYSTEM, AND MEDIUM" on Dec 20, 2023. With publication no. WO/2025/086443, the details related to the patent application was published on May 01, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed...