INTERNATIONAL PATENT: XPEEDIC CO., LTD., 芯和半导体科技（上海）股份有限公司 FILES APPLICATION FOR "ASSOCIATION UPDATING METHOD AND SYSTEM FOR EDA MODEL MODELING AND MEDIUM"

GENEVA, June 1 -- XPEEDIC CO., LTD. (Room 01, 4th Floor, No.5, Lane 60, Naxian Road, Pudong New AreaShanghai 201210), 芯和半导体科技（上海）股份有限公司 (中国上海市浦东新区纳贤路60弄5号4层01室) filed a patent application (PCT/CN2023/141806) for "ASSOCIATION UPDATING METHOD AND SYSTEM FOR EDA MODEL MODELING, AND MEDIUM" on Dec 26, 2023. With publication no. WO/2025/107399, the details related to the patent application was published on May 30, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) s...