GENEVA, Dec. 8 -- XIAMEN HONGFA AUTOMOTIVE ELECTRONICS CO., LTD. (No. 560-564 Donglin Road Jimei North Ind. Dist.Xiamen, Fujian 361021), 厦门宏发汽车电子有限公司 (中国福建省厦门市集美区集美北部工业区东林路560-564号) filed a patent application (PCT/CN2025/097492) for "ENCLOSURE, RELAY, AND METHOD FOR SEALING ENCLOSURE" on May 27, 2025. With publication no. WO/2025/247224, the details related to the patent application was published on Dec 04, 2025.
Notably, the patent application was submitted under the International Patent Classification (I...