GENEVA, June 16 -- XIAMEN AMPACK TECHNOLOGY LIMITED (No.600-1, Hongtang Road, Tongxiang High-tech Zone, Torch High-tech DistrictXiamen, Fujian 361000), 厦门新能达科技有限公司 (中国福建省厦门市火炬高新区同翔高新城洪塘路600-1号) filed a patent application (PCT/CN2024/134481) for "CIRCUIT MODULE AND BATTERY PACK SYSTEM" on Nov 26, 2024. With publication no. WO/2025/119032, the details related to the patent application was published on Jun 12, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) sys...