INTERNATIONAL PATENT: XI'AN ESWIN MATERIAL TECHNOLOGY CO., LTD., 西安奕斯伟材料科技股份有限公司 FILES APPLICATION FOR "WAFER, WAFER SURFACE NANOTOPOGRAPHY PREDICTION METHOD AND APPARATUS, DEVICE AND MEDIUM"

GENEVA, Jan. 11 -- XI'AN ESWIN MATERIAL TECHNOLOGY CO., LTD. (Room 1-3-029, No.1888 South Xifeng Rd., Hi-Tech ZoneXi'an, Shaanxi 710100), 西安奕斯伟材料科技股份有限公司 (中国陕西省西安市高新区西沣南路1888号1-3-029室) filed a patent application (PCT/CN2024/139558) for "WAFER, WAFER SURFACE NANOTOPOGRAPHY PREDICTION METHOD AND APPARATUS, DEVICE, AND MEDIUM" on Dec 16, 2024. With publication no. WO/2026/007342, the details related to the patent application was published on Jan 08, 2026.

Notably, the patent application was submitted under the Internationa...