INTERNATIONAL PATENT: XI'AN ESWIN MATERIAL TECHNOLOGY CO., LTD., 西安奕斯伟材料科技股份有限公司 FILES APPLICATION FOR "SILICON WAFER DEFECT MEASUREMENT METHOD AND APPARATUS"

GENEVA, March 8 -- XI'AN ESWIN MATERIAL TECHNOLOGY CO., LTD. (Room 1-3-029, No. 1888 South Xifeng Rd., Hi-tech ZoneXi'an, Shaanxi 710100), 西安奕斯伟材料科技股份有限公司 (中国陕西省西安市高新区西沣南路1888号1-3-029室) filed a patent application (PCT/CN2023/139449) for "SILICON WAFER DEFECT MEASUREMENT METHOD AND APPARATUS" on Dec 18, 2023. With publication no. WO/2025/043971, the details related to the patent application was published on Mar 06, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) sys...