INTERNATIONAL PATENT: WUHAN XINXIN SEMICONDUCTOR MANUFACTURING CO., LTD., 武汉新芯集成电路制造有限公司 FILES APPLICATION FOR "THREE-DIMENSIONAL INTEGRATED DEVICE AND FORMING METHOD THEREFOR"

GENEVA, Feb. 2 -- WUHAN XINXIN SEMICONDUCTOR MANUFACTURING CO., LTD. (No.18 Gaoxin 4TH Road, Donghu Development ZoneWuhan, Hubei 430205), 武汉新芯集成电路制造有限公司 (中国湖北省武汉市东湖开发区高新四路18号) filed a patent application (PCT/CN2023/130350) for "THREE-DIMENSIONAL INTEGRATED DEVICE AND FORMING METHOD THEREFOR" on Nov 08, 2023. With publication no. WO/2025/020353, the details related to the patent application was published on Jan 30, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) sys...