GENEVA, Sept. 1 -- WUHAN GRANDEUR MICROELECTRONICS CO., LTD. (Room 466, Floor 18, Building B4, Phase 1, Longshan Innovation Park, Wuhan Future Science And Technology City, No. 999, High Tech Avenue, East Lake Hightech Development Zone,Wuhan, Hubei 430000), 武汉光钜微电子有限公司 (中国湖北省武汉市武汉东湖高新技术开发区高新大道999号武汉未来科技城龙山创新园一期B4栋18楼466室) filed a patent application (PCT/CN2024/078311) for "PACKAGING S...