INTERNATIONAL PATENT: WUHAN CHOICE TECHNOLOGY CO., LTD., 武汉市三选科技有限公司 FILES APPLICATION FOR "UNDERFILL ADHESIVE HAVING LOW COEFFICIENT OF THERMAL EXPANSION AND PREPARATION METHOD THEREFOR AND CHIP PACKAGING STRUCTURE"

Posted On: 2025-09-08

GENEVA, Sept. 8 -- WUHAN CHOICE TECHNOLOGY CO., LTD. (Room 1710, 17F, Overseas Talent Building A, No 999 Gaoxin Ave., Wuhan East Lake Hi-Tech Development ZoneWuhan, Hubei 430000), 武汉市三选科技有限公司 (中国湖北省武汉市武汉东湖新技术开发区高新大道999号海外人才大楼A座17楼1710室) filed a patent application (PCT/CN2024/109781) for "UNDERFILL ADHESIVE HAVING LOW COEFFICIENT OF THERMAL EXPANSION AND PREPARATION METHOD THEREFOR, AND CHIP PACKAGING STRUCTURE" on Aug 05, 2024. With publication ...

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INTERNATIONAL PATENT: WUHAN CHOICE TECHNOLOGY CO., LTD., 武汉市三选科技有限公司 FILES APPLICATION FOR "UNDERFILL ADHESIVE HAVING LOW COEFFICIENT OF THERMAL EXPANSION AND PREPARATION METHOD THEREFOR AND CHIP PACKAGING STRUCTURE"