INTERNATIONAL PATENT: WASEDA UNIVERSITY, 学校法人早稲田大学, DENKA COMPANY LIMITED, デンカ株式会社 FILES APPLICATION FOR "CARBONATION CURING SYSTEM AND CARBONATION CURING METHOD"

Posted On: 2026-01-13

GENEVA, Jan. 13 -- WASEDA UNIVERSITY (104 Totsukamachi 1-chome, Shinjuku-ku, Tokyo1698050), 学校法人早稲田大学 (東京都新宿区戸塚町１丁目１０４番地), DENKA COMPANY LIMITED (1-1, Nihonbashi-Muromachi 2-chome, Chuo-ku, Tokyo1038338), デンカ株式会社 (東京都中央区日本橋室町二丁目１番１号) filed a patent application (PCT/JP2025/023899) for "CARBONATION CURING SYSTEM AND CARBONATION CURING METHOD" on Jul 02, 2025. With publication no. WO/2026/0099...

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इस लेख के रीप्रिंट को खरीदने या इस प्रकाशन का पूरा फ़ीड प्राप्त करने के लिए, कृपया हमे संपर्क करें.

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INTERNATIONAL PATENT: WASEDA UNIVERSITY, 学校法人早稲田大学, DENKA COMPANY LIMITED, デンカ株式会社 FILES APPLICATION FOR "CARBONATION CURING SYSTEM AND CARBONATION CURING METHOD"