INTERNATIONAL PATENT: VANCHIP (TIANJIN) TECHNOLOGY CO., LTD., 唯捷创芯（天津）电子技术股份有限公司 FILES APPLICATION FOR "PACKAGING STRUCTURE AND PACKAGING METHOD"

GENEVA, March 8 -- VANCHIP (TIANJIN) TECHNOLOGY CO., LTD. (Room 2701-3, Building 2 No. 19 Xinhuan W. Rd.Binhai New Area, Tianjin 300457), 唯捷创芯（天津）电子技术股份有限公司 (中国天津市滨海新区信环西路19号2号楼2701-3室) filed a patent application (PCT/CN2024/104170) for "PACKAGING STRUCTURE AND PACKAGING METHOD" on Jul 08, 2024. With publication no. WO/2025/044519, the details related to the patent application was published on Mar 06, 2025.

Notably, the patent application was submitted under the International Patent Classification (...