INTERNATIONAL PATENT: VANCHIP (TIANJIN) TECHNOLOGY CO., LTD., 唯捷创芯（天津）电子技术股份有限公司 FILES APPLICATION FOR "ACOUSTIC SURFACE WAVE FILTER PACKAGING STRUCTURE AND MANUFACTURING METHOD THEREFOR"

GENEVA, May 26 -- VANCHIP (TIANJIN) TECHNOLOGY CO., LTD. (Room 2701-3, Building 2 No. 19 Xinhuan W. Rd.Binhai New Area, Tianjin 300457), 唯捷创芯（天津）电子技术股份有限公司 (中国天津市滨海新区信环西路19号2号楼2701-3室) filed a patent application (PCT/CN2024/126592) for "ACOUSTIC SURFACE WAVE FILTER PACKAGING STRUCTURE AND MANUFACTURING METHOD THEREFOR" on Oct 23, 2024. With publication no. WO/2025/103095, the details related to the patent application was published on May 22, 2025.

Notably, the patent application was submitted under ...