GENEVA, Sept. 29 -- UNIMATEC CO., LTD. (12-15, Shibadaimon 1-chome, Minato-ku, Tokyo1050012), ユニマテック株式会社 (東京都港区芝大門１丁目１２番１５号) filed a patent application (PCT/JP2024/046398) for "ADHESIVE COMPOSITION, COVERLAY, BONDING SHEET, AND ELECTRONIC SUBSTRATE" on Dec 27, 2024. With publication no. WO/2025/197246, the details related to the patent application was published on Sep 25, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO)....