INTERNATIONAL PATENT: ULTRAMEMORY INC., ウルトラメモリ株式会社 FILES APPLICATION FOR "DIE LAMINATION MODULE AND METHOD FOR MANUFACTURING DIE LAMINATION MODULE"

GENEVA, July 8 -- ULTRAMEMORY INC. (Access Bldg. 3F, 11-8, Asahi-cho, Hachioji-shi, Tokyo1920083), ウルトラメモリ株式会社 (東京都八王子市旭町１１－８　アクセスビル３階) filed a patent application (PCT/JP2023/047219) for "DIE LAMINATION MODULE AND METHOD FOR MANUFACTURING DIE LAMINATION MODULE" on Dec 28, 2023. With publication no. WO/2025/141849, the details related to the patent application was published on Jul 03, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by...