INTERNATIONAL PATENT: U-MAP CO., LTD., 株式会社Ｕ－ＭＡＰ FILES APPLICATION FOR "HEAT DISSIPATION FILLER, RESIN COMPOSITION AND RESIN MOLDED BODY"

GENEVA, Feb. 4 -- U-MAP CO., LTD. (1003, Cresto Motoyama, 1-29, Honami-cho, Chikusa-ku, Nagoya-shi, Aichi4640822), 株式会社Ｕ－ＭＡＰ (愛知県名古屋市千種区穂波町一丁目２９番地　クレスト本山１００３) filed a patent application (PCT/JP2024/026356) for "HEAT DISSIPATION FILLER, RESIN COMPOSITION, AND RESIN MOLDED BODY" on Jul 23, 2024. With publication no. WO/2025/023254, the details related to the patent application was published on Jan 30, 2025.

Notably, the patent application was submitted under the Inte...