GENEVA, Oct. 13 -- TOYO SEIKAN GROUP HOLDINGS, LTD. (18-1, Higashi-Gotanda 2-chome, Shinagawa-ku, Tokyo1418627), 東洋製罐グループホールディングス株式会社 (東京都品川区東五反田2丁目18番1号) filed a patent application (PCT/JP2025/011024) for "POROUS SILICA DOPED WITH MULTIPLE TYPES OF METALS AND CONTAINING HIGH COPPER CONTENT" on Mar 21, 2025. With publication no. WO/2025/211177, the details related to the patent application was published on Oct 09, 2025.
Notably, the patent application was submitted under the Int...