GENEVA, April 15 -- TOYO SEIKAN GROUP HOLDINGS, LTD. (18-1, Higashi-Gotanda 2-chome, Shinagawa-ku, Tokyo1418627), 東洋製罐グループホールディングス株式会社 (東京都品川区東五反田２丁目１８番１号) filed a patent application (PCT/JP2024/033573) for "POROUS RESIN MOLDED BODY" on Sep 20, 2024. With publication no. WO/2025/074882, the details related to the patent application was published on Apr 10, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is man...