GENEVA, March 25 -- TOYO SEIKAN GROUP HOLDINGS, LTD. (18-1, Higashi-Gotanda 2-chome, Shinagawa-ku, Tokyo1418627), 東洋製罐グループホールディングス株式会社 (東京都品川区東五反田2丁目18番1号) filed a patent application (PCT/JP2024/032328) for "PLATE MATERIAL FORMING METHOD, CAN LID FORMING METHOD, AND CAN BOTTOM FORMING METHOD" on Sep 10, 2024. With publication no. WO/2025/057924, the details related to the patent application was published on Mar 20, 2025.

Notably, the patent application was submitted under the In...