GENEVA, July 2 -- TOYO SEIKAN CO., LTD. (2-18-1, Higashi-Gotanda, Shinagawa-ku, Tokyo1418640), 東洋製罐株式会社 (東京都品川区東五反田２－１８－１) filed a patent application (PCT/JP2024/036221) for "MOLDING CONDITION ADJUSTMENT METHOD AND MOLDING CONDITION ADJUSTMENT DEVICE" on Oct 10, 2024. With publication no. WO/2025/134490, the details related to the patent application was published on Jun 26, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Inventor(s): WATAN...