INTERNATIONAL PATENT: TOWA CORPORATION, ＴＯＷＡ株式会社 FILES APPLICATION FOR "SUCTION PLATE, CUTTING DEVICE AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT"

GENEVA, May 5 -- TOWA CORPORATION (5, Kamitoba Kamichoshi-cho, Minami-ku, Kyoto-shi, Kyoto6018105), ＴＯＷＡ株式会社 (京都府京都市南区上鳥羽上調子町５番地) filed a patent application (PCT/JP2024/023733) for "SUCTION PLATE, CUTTING DEVICE, AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT" on Jul 01, 2024. With publication no. WO/2025/088848, the details related to the patent application was published on May 01, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (...