GENEVA, June 10 -- TOWA CORPORATION (5, Kamitoba Kamichoshi-cho, Minami-ku, Kyoto-shi, Kyoto6018105), ＴＯＷＡ株式会社 (京都府京都市南区上鳥羽上調子町５番地) filed a patent application (PCT/JP2024/028961) for "RESIN SUPPLY DEVICE, RESIN MOLDED ARTICLE MANUFACTURING DEVICE, AND RESIN MOLDED ARTICLE MANUFACTURING METHOD" on Aug 14, 2024. With publication no. WO/2025/115304, the details related to the patent application was published on Jun 05, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intel...