INTERNATIONAL PATENT: TOWA CORPORATION, ＴＯＷＡ株式会社 FILES APPLICATION FOR "DEVICE FOR RESIN MOLDING AND METHOD FOR PRODUCING MOLDED RESIN ARTICLE"

GENEVA, March 24 -- TOWA CORPORATION (5, Kamitoba Kamichoshi-cho, Minami-ku, Kyoto-shi, Kyoto6018105), ＴＯＷＡ株式会社 (京都府京都市南区上鳥羽上調子町５番地) filed a patent application (PCT/JP2024/019868) for "DEVICE FOR RESIN MOLDING AND METHOD FOR PRODUCING MOLDED RESIN ARTICLE" on May 30, 2024. With publication no. WO/2025/057499, the details related to the patent application was published on Mar 20, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO)....