INTERNATIONAL PATENT: TORAY ENGINEERING CO., LTD., 東レエンジニアリング株式会社 FILES APPLICATION FOR "WAFER DIVIDING METHOD AND MACHINING METHOD AND WAFER DIVIDING DEVICE"

GENEVA, May 13 -- TORAY ENGINEERING CO., LTD. (Yaesu Ryumeikan Bldg., 3-22, Yaesu 1-chome, Chuo-ku, Tokyo1030028), 東レエンジニアリング株式会社 (東京都中央区八重洲１丁目３番２２号（八重洲龍名館ビル）) filed a patent application (PCT/JP2024/037513) for "WAFER DIVIDING METHOD AND MACHINING METHOD, AND WAFER DIVIDING DEVICE" on Oct 22, 2024. With publication no. WO/2025/094757, the details related to the patent application was published on May 08, 2025.

Notably, the patent application was submitted un...