INTERNATIONAL PATENT: TOPPAN HOLDINGS INC., ＴＯＰＰＡＮホールディングス株式会社 FILES APPLICATION FOR "PACKAGING MATERIAL AND PACKAGING BAG"

GENEVA, Feb. 3 -- TOPPAN HOLDINGS INC. (5-1, Taito 1-chome, Taito-ku, Tokyo1100016), ＴＯＰＰＡＮホールディングス株式会社 (東京都台東区台東１丁目５番１号) filed a patent application (PCT/JP2024/022886) for "PACKAGING MATERIAL AND PACKAGING BAG" on Jun 24, 2024. With publication no. WO/2025/022903, the details related to the patent application was published on Jan 30, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIP...