GENEVA, May 12 -- TOPPAN HOLDINGS INC. (5-1, Taito 1-chome, Taito-ku, Tokyo1100016), ＴＯＰＰＡＮホールディングス株式会社 (東京都台東区台東一丁目５番１号) filed a patent application (PCT/JP2024/030625) for "MULTILAYER WIRING BOARD, AND METHOD FOR MANUFACTURING MULTILAYER WIRING BOARD" on Aug 28, 2024. With publication no. WO/2025/094490, the details related to the patent application was published on May 08, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the Worl...