GENEVA, Dec. 23 -- TOPPAN HOLDINGS INC. (5-1, Taito 1-chome, Taito-ku, Tokyo1100016), ＴＯＰＰＡＮホールディングス株式会社 (東京都台東区台東一丁目５番１号) filed a patent application (PCT/JP2025/020181) for "MULTILAYER WIRING BOARD, SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING MULTILAYER WIRING BOARD" on Jun 04, 2025. With publication no. WO/2025/258471, the details related to the patent application was published on Dec 18, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which...