GENEVA, July 8 -- TOPPAN HOLDINGS INC. (5-1, Taito 1-chome, Taito-ku, Tokyo1100016), ＴＯＰＰＡＮホールディングス株式会社 (東京都台東区台東一丁目５番１号) filed a patent application (PCT/JP2024/043754) for "MULTILAYER WIRING BASE SUBSTRATE, MULTILAYER WIRING BOARD, AND METHOD FOR MANUFACTURING MULTILAYER WIRING BOARD" on Dec 11, 2024. With publication no. WO/2025/142479, the details related to the patent application was published on Jul 03, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) sy...