GENEVA, July 3 -- TOPPAN HOLDINGS INC. (5-1, Taito 1-chome, Taito-ku, Tokyo1100016), ＴＯＰＰＡＮホールディングス株式会社 (東京都台東区台東１丁目５番１号) filed a patent application (PCT/JP2024/044338) for "METASURFACE STRUCTURE AND MOLD" on Dec 16, 2024. With publication no. WO/2025/134960, the details related to the patent application was published on Jun 26, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
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